It’s reported that TSMC will raise the price of its 3nm process by 15% in H2 2026, and may raise it by another 10% in 2027.
Silicon Valley companies have been providing financing to SK Hynix, but SK Hynix wants only a long-term contract.
It’s reported that Samsung is planning to build a $1.5 billion memory chip testing plant in Vietnam, scheduled to be operational in November 2027.
Qualcomm has reportedly reached an agreement with ByteDance on the supply of AI chips, particularly ASICs for AI data centers.
The mass production of Apple’s first iPhone Fold is not optimistic; supply chain sources say that surface mount technology (SMT) is the biggest challenge.
Tencent’s self-developed “Canghai Chip” V2 is about to enter mass production.
UMC: Selective price increases will be implemented in H2 2026; more comprehensive price negotiations will take place in 2027.
The global NAND Flash market reached $42.815 billion in Q1 2026, representing an 81.8% increase quarter-over-quarter. CFM
Samsung labor agreement passed, temporarily alleviating the risk of a strike.
