TSMC and INTEL are accelerating their investments in glass substrate and panel-level packaging.
OPENAI partnered with Broadcom to launch its first custom AI chip, Jalapeño; saving 50% on costs.
IBM: Nano-stacking technology at sub-nanometer nodes is expected to be mass-produced within 5 years.
SK Hynix plans to issue up to $29.4 billion in American Depositary Receipts (ADRs), expected to be listed on Nasdaq on July 10, 2026.
Jensen Huang: The era of Useful AI has arrived, and the construction of AI infrastructure will continue for decades.
Pragmatic Semiconductor introduces Pragmatic NFC Protect, providing a one-stop solution for product counterfeiting and tampering issues.
Qualcomm enters the AI data center track: it will customize compliant AI chips for the Chinese market.
ASE: Simultaneously expanding production scale of 15 factories; the highly automated FOPLP mass production line will be put into operation before the end of 2026.
Japan plans to invest $2.3 trillion in AI and semiconductors over the next 14 years.
