INTEL wins Google’s next-generation TPU packaging order.
TSMC will reinvest $20 billion in TSMC Arizona to build a 12-inch wafer fab and advanced packaging plants.
Samsung reportedly secured over $6.54 billion in orders from Meta for manufacturing 2nm AI chips.
Anthropic is in talks with Samsung to collaborate on developing a custom AI chip, according to reports.
Samsung 4nm process capacity is nearly sold out, and some of its 8nm capacity is already operating at full capacity and has begun accepting orders selectively.
Infineon launches the world’s largest power semiconductor and analog/mixed-signal chip Smart Power Fab.
An EU report states that dependence on US technology is a “core concern” for the European chip industry.
Samsung has initiated Q3 price negotiations, aiming for a 20% quarter-on-quarter increase in general-purpose DRAM prices.
Kioxia-SanDisk BiCS10 (332 layers) 3D NAND flash memory has entered the sampling stage.
