It’s reported that NVIDIA has cancelled the quad-GPU version of Rubin Ultra and will instead use a dual-GPU design.
Samsung’s HBM4E yield rate exceeds 70%, and the development of the seventh-generation AI memory has entered a stable stage.
Goldman Sachs raises 2027 HBM price forecast: Samsung’s annual growth rate is expected to increase from 14% to 44%.
OpenAI is reportedly improving its technology to halve inference costs, with GPU usage plummeting to just a few hundred units.
AMD releases Versal Premium Gen2 MoP adaptive system-on-chip (SoC).
Qualcomm will hold the Snapdragon Summit from September 22 to 24, 2026, and release the Snapdragon 8 Elite Gen 6 chip with 2nm process then.
ASE has raised the prices of its advanced packaging products by up to 20%.
Kyocera will invest $4 billion to strengthen its semiconductor and data center component business.
Yageo has notified its customers that the prices of all its capacitor products (including MLCCs) will increase starting July 1, 2026.
INTEL expands photomask production capacity at Bowers Campus; CEO Lip-Bu Tan and several foundry executives attended the meeting.
Amazon AWS will invest $1 billion to establish an embedded AI engineering division.
