TSMC accelerates 3nm process shipments, aiming to reach 180,000 wafers and the 2nm process shipment target is 100,000 wafers in Q4 2026. Wedbush
NVIDIA is reportedly considering reducing the memory configuration of Rubin Ultra GPUs due to a shortage of HBM supply.
Samsung’s 4nm process capacity is fully booked until 2027; Samsung is pushing hard for 5nm process production to capitalize on surging orders from China and India.
SK Hynix will invest $3.81 billion to expand chip factories in South Korea.
SpaceX and Tesla held a groundbreaking ceremony for the Terafab chip factory, a $16.8 billion project focused on logic and memory manufacturing.
AMD acquires Taalas: Strengthening AI inference to advance full-stack AI.
UAE plans to invest $6.3 billion in Japan to build an AI data center.
WSTS: The semiconductor market is projected to reach $1.655 trillion by 2026, with memory revenue expected to more than triple.
A team from TSMC and National Yang Ming Chiao Tung University has successfully developed a monolayer molybdenum disulfide (MoS2) top-gate transistor, which helps to break through the limitations of Moore’s Law.
