Jensen Huang: NVIDIA’s chip sales in 2027 will be double those of 2026.
TSMC expands into Longtan Science Park Phase III: Plans to build three wafer fabs, prioritizing 1.4nm process.
Samsung has begun trial production of Tesla’s AI5 chips at its plant in Taylor, Texas. BusinessKorea
Solidigm reportedly plans to build a NAND flash memory plant in the US.
CoWoS-L is expected to remain the mainstream packaging solution for AI chips through 2028. TrendForce
India’s new semiconductor initiative has secured investment commitments totaling $12 billion.
Nexperia partners with Tata to manufacture and package chips in India.
GlobalFoundries and Marvell expand their partnership to increase production capacity for silicon-germanium optical communication chips used in AI data centers.
AMD will establish its first AI Center of Excellence in Asia in South Korea, launching by the end of 2026.
Apple AI server exposed: codenamed “Baltra”, equipped with self-developed M8 Ultra chip.
NVIDIA and Google team up to tackle AI power management challenges.
