TSMC’s 5.5x CoWoS photomask has entered the mass production stage.
SK Hynix is working to advance its extreme ultraviolet (EUV) lithography technology to enable the mass production of next-generation DRAM.
Microsoft may release the Maia 300 as early as September 2026 and has already begun negotiations with TSMC regarding production capacity.
Musk targets extreme ultraviolet light sources: Free-electron laser technology is gaining popularity, and chip costs may be about to undergo a revolutionary change.
South Korea will establish a fund of over US$3.52 billion to focus on investing in semiconductor materials, components, and equipment.
Jensen Huang: AI computing power has become an investable asset.
Diodes to acquire ElevATE Semiconductor for $250 million.
Amkor reportedly considers sale of stake in China business.
