It’s reported that Samsung aims to be the first to complete the development of 1dnm DRAM memory by September 2026. TheBell
NVIDIA announced that its Spectrum-X Ethernet silicon photonics switch has entered full production, marking the world’s first 200G/channel CPO (co-packaged optical device) Ethernet switch system to achieve large-scale commercialization.
TSMC’s CoWoS is facing a capacity shortage. It’s reported that some advanced packaging back-end orders have been outsourced to INTEL’s Malaysian factory, with some capacity being used to support and serve a common large customer, breaking with previous ecosystem practices.
Due to surging demand for AI chips, Samsung has raised its foundry prices, with some advanced process technologies seeing price increases of up to 15%.
Cerebras Systems released a new rack-mounted AI system, CS-4, which can output 30 times more tokens per second than a traditional GPU server in a single-user scenario.
Morgan Stanley warns that memory price increases remain strong; prices for mature process DRAM could rise by 50% in Q3 2026.
LG Display plans to invest $2.15 billion in R&D of FLiPP OLED technology.
Analog Devices plans new price adjustment effective September 13, 2026.
Samsung: Advanced process will contribute more than half of the revenue from the wafer foundry business in 2026; the SF4 production line is already operating at full capacity.
