Jensen Huang: A brand new unprecedented chip will be released in March 2026. Storage manufacturers are scaling up production and raising prices, with the price of HBM4 increasing by nearly 30%. Demand for AI data centers is surging. Murata plans…
CFM: Global DRAM/NAND flash memory market will reach $75.51 billion by Q4 2025, representing a 29.2% increase quarter-over-quarter. US imposed a 93.5% anti-dumping duty and a 67% countervailing duty on graphite anodes for Chinese batteries. Saudi Arabic Aramco and Microsoft…
Samsung has begun shipping HBM4 chips, with a 22% speed increase. NVIDIA Blackwell architecture reduces AI inference costs to 90%. Tower Semiconductor: INTEL intends to terminate wafer foundry manufacturing cooperation between the two parties. Driven by the AI boom and…
Samsung plans to launch LPDDR5X-PIM samples in H2 2026. ZDNet Micron CFO Mark Murphy: HBM4 has mass-produced and shipments have already begun. TheElec SK Hynix launched a hybrid HBF and HBM architecture, offering up to 2.69 times the performance improvement.…
Samsung: Mass production of HBM4 has begun and commercial shipments to customers are underway. Meta invests $10 billion to build AI data center in Indiana. Samsung has provided Qualcomm with LPDDR6X memory samples, which may be used in the AI250…
It’s reported that ByteDance is developing its own AI chip, which will be manufactured by Samsung: 100,000 chips will be produced in 2026 at least. SK Hynix is developing a new technology called “AIP (All-In-Plug)” to reduce the manufacturing cost of…
It’s reported that TSMC expands investment in the US in exchange for exemptions from chip tariffs. Rapidus plans to begin production of 2nm process in 2028. Samsung Exynos 2700 chip is expected to begin mass production in H2 2026, potentially…
NVIDIA is developing a high-end GPU positioned above the existing RTX 5090. TSMC plans to transfer 80% of its 8-inch wafer capacity to VIS. It’s reported that SK Chairman and Jensen Huang held a “fried chicken meeting” in US on…
TSMC aims to achieve a CoWoS capacity of 115,000 wafers, while Taiwan four major semiconductor packaging and testing companies (ASE, Powertech, SPIL, KYEC) are also making significant investments. Amazon and STMicroelectronics have reached an agreement on building a data center.…
Qualcomm 2nm chip has been successfully taped out in India. INTEL and AMD have notified their Chinese customers of a CPU shortage with delivery times of up to six months. Samsung will be the first to mass-produce HBM4 and will…
