Meta has increased the price of its Quest VR headset, as memory chip prices are rising. Sony’s image sensor factory in Kumamoto will receive a subsidy of $380 million from the Japanese government. Tesla is hiring engineers in Taiwan, requiring…
TSMC: Advanced packaging capacity is extremely tight. OpenAI has once again abandoned its “Stargate” project in Norway; Microsoft has taken over and gained computing power from 30,000 NVIDIA chips. Stellantis has signed a five-year partnership agreement with Microsoft to jointly…
C.C. Wei discusses the competition between Terafab and INTEL: No shortcuts to expanding production capacity. The industrialization of glass substrates is accelerating: TSMC is building a pilot project for a CoPoS packaging production line. Musk has demanded that the Terafab…
TSMC C.C. Wei discusses pricing strategy: No major price adjustments. Jensen Huang: The input is electronics, the output is tokens, and NVIDIA is in the middle. Tesla has completed the tape-out of its AI5 chip, which will be manufactured by…
Goldman Sachs: The memory supercycle is expected to continue until 2027. Samsung has begun providing customers with samples of GDDR7 memory with speeds of 36 Gbps and a single-chip capacity of 24Gb (i.e., 3GB). Musk stated that Tesla has completed…
Samsung Electro-Mechanics plans to build an MLCC embedded substrate production line in Vietnam to expand AI packaging capacity. Broadcom and Meta have signed a multi-year AI chip collaboration agreement. South Korean memory chips face a major risk: Israel’s bromine supply…
NVIDIA denied acquiring Dell and HP. The spot rental prices of NVIDIA’s entire range of GPUs in cloud data centers have increased significantly. Ornn SEMI: Global semiconductor manufacturing equipment sales will reach $135.1 billion by 2025, a 15% increase. The…
It’s reported that Samsung’s 2nm process yield is currently around 55%. UBS has raised its forecast for Broadcom’s 2027 TPU shipments to 7 million units. Samsung SDI may supply batteries to Mercedes-Benz; the two parties have entered the final stage…
TSMC’s CoPoS production line is expected to be fully completed in June 2026. Samsung Electro-Mechanics will provide FC-BGA packaging substrates for NVIDIA’s Groq3 AI chip. Apple has significantly increased its SoIC capacity bookings with TSMC, targeting Baltra AI server chips.…
TSMC expands its advanced packaging technologies in Taiwan, China, and the US, with CoWoS and CoPoS technologies adopted across various locations. Amazon: Invests more than $200 billion by 2026 to accelerate AI and infrastructure development. Eight Japanese companies, including SoftBank,…
