Samsung has indefinitely postponed mass production of the HBM5E due to substandard yield rates. SK Hynix’s advanced packaging plant began construction in April 2026. Amazon has reduced the construction time for its AI data centers from 15 weeks to 3…
SK Hynix: It has begun mass production of 192GB SOCAMM2 memory modules designed specifically for NVIDIA’s next-generation Vera Rubin AI chip. INTEL is about to launch the 14A process, and UBS speculates that its customers may include NVIDIA and Apple.…
TSMC’s 2nm capacity is already saturated, while Samsung’s foundry services are targeting customers’ replacement needs. The market expects TSMC’s sub-1nm process to enter the trial production stage in 2029. Samsung plans to deliver HBM4E chip samples to NVIDIA in May…
Meta paid Broadcom $2.3 billion in 2025. Samsung to phase out LPDDR4/4X, shifts focus to LPDDR5 and advanced DRAM. The combined revenue of the top 10 global semiconductor equipment manufacturers exceeded US$130 billion by 2025. CINNO • IC Research BYD…
Meta has increased the price of its Quest VR headset, as memory chip prices are rising. Sony’s image sensor factory in Kumamoto will receive a subsidy of $380 million from the Japanese government. Tesla is hiring engineers in Taiwan, requiring…
TSMC: Advanced packaging capacity is extremely tight. OpenAI has once again abandoned its “Stargate” project in Norway; Microsoft has taken over and gained computing power from 30,000 NVIDIA chips. Stellantis has signed a five-year partnership agreement with Microsoft to jointly…
C.C. Wei discusses the competition between Terafab and INTEL: No shortcuts to expanding production capacity. The industrialization of glass substrates is accelerating: TSMC is building a pilot project for a CoPoS packaging production line. Musk has demanded that the Terafab…
TSMC C.C. Wei discusses pricing strategy: No major price adjustments. Jensen Huang: The input is electronics, the output is tokens, and NVIDIA is in the middle. Tesla has completed the tape-out of its AI5 chip, which will be manufactured by…
Goldman Sachs: The memory supercycle is expected to continue until 2027. Samsung has begun providing customers with samples of GDDR7 memory with speeds of 36 Gbps and a single-chip capacity of 24Gb (i.e., 3GB). Musk stated that Tesla has completed…
Samsung Electro-Mechanics plans to build an MLCC embedded substrate production line in Vietnam to expand AI packaging capacity. Broadcom and Meta have signed a multi-year AI chip collaboration agreement. South Korean memory chips face a major risk: Israel’s bromine supply…