TSMC has unveiled its AP7 packaging and testing facility in Chiayi for the first time, aiming to expand capacity to meet Apple orders and AI needs. INTEL: Two potential customers plan to use INTEL 14A test chip. Samsung HBM4 chip…
TSMC will reduce capacity of Fab14 12-inch mature process node by 15%-20% by 2028, to address low capacity utilization of traditional process nodes, while expanding advanced packaging. Jensen Huang visited China again, with his first stop being Shanghai office. Samsung…
TSMC plans to cut capacity at its mature Fab 14 node by 15%-20%. Counterpoint Research NVIDIA has reportedly suspended supply of its RTX 50 series graphics cards for six months. Musk: The limiting factor for the deployment of AI is…
Samsung secret weapon: Enhanced heat dissipation to secure orders for its 2nm process. INTEL struggles to meet the demands of AI data centers; 1.8nm process yield falls short of Lip-Bu Tan expectations. Microsoft CEO Satya Nadella: Energy costs will determine…
Samsung uses a 2nm process to design HBM logic chips. Storage industry is projected to reach $551.6 billion in revenue by 2026, representing a year-on-year growth of 134%. TrendForce Some memory manufacturers have orders booked until 2030. China has launched…
Jensen Huang confirmed that NVIDIA has replaced Apple as TSMC largest customer. Lip-Bu Tan restructuring efforts are yielding results; INTEL operational recovery is being tested by the market. NVIDIA Jensen Huang: AI robots present Europe with a once-in-a-generation opportunity. Samsung…
TSMC AP7 (Advanced Packaging) to debut in Chiayi on January 22nd, 2026 and TSMC’s CoPoS is scheduled to enter mass production by the end of 2028. G42: Advanced AI chips from NVIDIA, AMD will arrive in the UAE within a…
TSMC 3nm capacity will be fully utilized until 2027. NVIDIA CEO Jensen Huang plans to visit China in late January 2026 to revitalize the AI chip market. NVIDIA has become TSMC largest customer; reports indicate that TSMC will cancel Apple’s…
TSMC continues to increase investment in advanced packaging because Apple A20 chip may use WMCM technology. Samsung expects its overall capacity utilization rate for its wafer foundry business to recover to 60% in H1 2026. SK Hynix DRAM process at…
Samsung and SK Hynix will reduce their NAND flash memory wafer production in 2026. ChosunBiz Global DRAM supply forecast for 2027 may be revised upward. TrendForce Japan and US are moving forward with a $550 billion investment plan; SoftBank’s data…