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Semiconductor Industrial Breaking News

TSMC is preparing to transfer its 2nm technology to US and is preparing a…

Nvidia: No “backdoor” in the H20 chip. OpenAI will build its first European data…

Nvidia’s Rubin GPU may be the first GPU to introduce CoWoP packaging. H20 poses…

Samsung expects operating profit at its chip business to plummet 94% year-on-year in Q2…

Samsung plans to invest an additional $7 billion to build an advanced packaging factory…

Global CoWoS wafer demand will reach 1 million pieces in 2026, with Nvidia accounting…

Nvidia has reportedly ordered 300,000 H20 chips from TSMC due to strong Chinese demand.…

Apple is reportedly evaluating Intel 14A process. Tesla placed an order for AI6 chips…

TSMC has started its advanced packaging layout in US. Nvidia N1X details revealed: 20-core…