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TSMC will reduce capacity of Fab14 12-inch mature process node by 15%-20% by 2028,…

TSMC plans to cut capacity at its mature Fab 14 node by 15%-20%. Counterpoint…

Samsung secret weapon: Enhanced heat dissipation to secure orders for its 2nm process. INTEL…

Samsung uses a 2nm process to design HBM logic chips. Storage industry is projected…

Jensen Huang confirmed that NVIDIA has replaced Apple as TSMC largest customer. Lip-Bu Tan…

TSMC AP7 (Advanced Packaging) to debut in Chiayi on January 22nd, 2026 and TSMC’s…

TSMC 3nm capacity will be fully utilized until 2027. NVIDIA CEO Jensen Huang plans…

TSMC continues to increase investment in advanced packaging because Apple A20 chip may use…

Samsung and SK Hynix will reduce their NAND flash memory wafer production in 2026.…