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Jensen Huang confirmed that NVIDIA has replaced Apple as TSMC largest customer. Lip-Bu Tan…

TSMC AP7 (Advanced Packaging) to debut in Chiayi on January 22nd, 2026 and TSMC’s…

TSMC 3nm capacity will be fully utilized until 2027. NVIDIA CEO Jensen Huang plans…

TSMC continues to increase investment in advanced packaging because Apple A20 chip may use…

Samsung and SK Hynix will reduce their NAND flash memory wafer production in 2026.…

Data centers will consume 70% of the world’s memory chips by 2026, and the…

Elon Musk: The Colossus 2 supercomputer for Grok is now operational. First Gigawatt training…

NVIDIA suppliers halt production of key components for H200 chips. It’s reported that Samsung…

Apple first foldable phone, the iPhone Fold, features the A20 Pro chip manufactured using…