
Semiconductor Industrial Breaking News
SEMICON Taiwan 2025 will focus on advanced packaging technologies including 3DIC, fan-out panel packaging…

SEMICON Taiwan 2025 will focus on advanced packaging technologies including 3DIC, fan-out panel packaging…

Samsung Foundry is seeking to compete for Nvidia’s 2nm GPU orders. TSMC confirmed to…

Intel CEO Lip-Bu Tan is evaluating whether to shift focus from the 18A process…

TSMC will reportedly stop producing GaN and will move to advanced packaging at Fab…

Intel is considering adjusting its foundry business strategy: Directly adopting the 14A process for…

Nvidia GB300 AI server will be available in H2 2025. Analyst: Texas Instruments analog…

Chips produced at TSMC US factories still need to be flown back to Taiwan…

The release of Microsoft self-developed AI chip Braga was delayed by 6 months and…

NVIDIA GB300 AI server is about to be shipped, and the demand for 1.6T…