Category Telecommunications

TSMC plans to cut capacity at its mature Fab 14…

Samsung secret weapon: Enhanced heat dissipation to secure orders for…

Samsung uses a 2nm process to design HBM logic chips.…

Jensen Huang confirmed that NVIDIA has replaced Apple as TSMC…

TSMC AP7 (Advanced Packaging) to debut in Chiayi on January…

TSMC 3nm capacity will be fully utilized until 2027. NVIDIA…

TSMC continues to increase investment in advanced packaging because Apple…

Samsung and SK Hynix will reduce their NAND flash memory…

Data centers will consume 70% of the world’s memory chips…