The secret of where the $53 billion of the “CHIP Act” went. America reshapes the semiconductor landscape.
Intel suffered a huge loss of $16.6 billion in Q3 2024. Intel expects Q4 2024 revenue to be between $13.3 billion and $14.3 billion, and announced two new customers for the 18A process.
Apple two most powerful NB chips are coming, faster, more power-efficient, and running 24 hours a day, seizing the AI PC business opportunity. Apple officially released two advanced chips, M4 Pro and M4 Max, which are new members of the M4 family produced using the second-generation 3-nanometer technology. The performance of M4 Pro is said to surpass all current AI PC chips. It is expected that all new chips will be manufactured using TSMC 3-nanometer family process, helping major customer Apple expand its AI product line.
ASE previously estimated that the revenue from advanced packaging and testing will increase by US$250 million in 2024. CFO Dong Hongsi emphasized that the related performance this year will exceed US$500 million, achieving the goal of doubling the revenue from advanced packaging and testing ahead of schedule. With advanced packaging as the main force, it has focused on establishing advanced testing capacity. Even though the performance contribution of the advanced testing business is relatively small at present, a significant increase in its contribution to operations will be seen starting in 2025.
JNTC, South Korean 3D cover glass manufacturer, recently announced that it has provided 510×515mm new TGV glass substrate samples to three semiconductor packaging companies around the world.
The Biden administration announced that it will invest $825 million to build a flagship facility for the National Semiconductor Technology Center (NSTC) in Albany, New York. The U.S. Department of Commerce said the Albany, New York site will focus on extreme ultraviolet (EUV) lithography technology.
It is said that Apple plans to use its own Wi-Fi chips in new products (such as iPhone 17) in the second half of 2025 to reduce its dependence on Broadcom. The Wi-Fi chip is manufactured using TSMC’s N7 (7nm) process and supports the latest Wi-Fi 7 specification.
It has been two years since the US introduced the CHIPS Act, but Intel has not received a penny. At a time when Intel’s performance is poor and its market value has plummeted, the subsidies provided by the Biden administration should have been a lifeline, but they have not appeared for a long time. This made Intel CEO complain publicly recently.
