NVIDIA CEO Jensen Huang: GB200 production is progressing smoothly, AI server production line is fully loaded.
The Biden administration is preparing to launch a trade investigation into “older model” semiconductors produced in China in response to concerns that the United States growing reliance on those products could pose a national security threat, according to government and industry documents reviewed by The New York Times and people familiar with the matter.
Litigation over patent licensing dispute between Arm and Qualcomm begins: difference in licensing fees reaches $50 million.
TSMC first wafer factory built in Kumamoto, Japan will start mass production before the end of 2024. The first batch of production capacity will be supplied to Sony Group and Denso.
GlobalWafers receives $406 million in CHIP Act subsidies.
The sixth-generation DRAM has not yet entered mass production, but Samsung seventh-generation DRAM test line has begun construction.
The European Commission has approved €1.3 billion in subsidies to Italy under EU State aid rules to support Singaporean startup Silicon Box in building a semiconductor advanced packaging and testing facility in Novara.
The U.S. government has launched a national security investigation into Chinese router maker TP-Link.
Rapidus obtained the first EUV lithography machine and plans to mass-produce 2nm chips in 2027.
