Semiconductor Industrial Breaking News – Posted on Jun 17th, 2025-3
Meta will launch the next-generation ASIC chip MTIA T-V1 as early as Q4 2025.
Huawei new “quad-chiplet package” patent was exposed, which may be related to Ascend 910D.
SK Hynix has begun preparing to supply 12-layer HBM3E to Amazon. ZDNet Korea
HBM future development roadmap revealed: HBM8 bandwidth will reach 64TB/s.
Anker recalls over 1 million power banks in US.
Longsys and Sandisk join forces to open a new chapter of high-quality cooperation in UFS.
Samsung Flip 7 small folding phone may use the Exynos 2500 chip.
US is forcing Vietnam’s manufacturing industry to de-Sinicize, with the 46% tariff becoming a bargaining chip.
