TSMC first batch of 4nm wafers in US has completed production and has been shipped to Taiwan for packaging.
KAIST: HBM5 will be commercialized in 2029, and performance depends on immersion cooling.
AWS will use its own ASICs to reduce its reliance on Nvidia.
Taiwanese semiconductor manufacturers are focusing on fan-out panel-level packaging (FOPLP).
Samsung Exynos 2600 is rumored to abandon the 10-core architecture and adopt an 8-core CPU.
NXP completes acquisition of TTTech Auto, accelerating transformation to software-defined vehicles.
The global smart glasses market shipments reached 1.487 million units in Q1 2025, a year-on-year increase of 82.3%.
It is reported that Tesla Austin factory will suspend production of Cybertruck and Model Y for one week starting from June 30 2025.
Cadence and Samsung Foundry collaborate to accelerate SoC, 3D-IC and chiplet designs for AI data centers, automotive and connectivity.
