Intel Ohio factory construction delayed, AEP’s $95 million substation idled.
Fujitsu 2nm CPU is manufactured by TSMC, but it will consider using Rapidus to ensure a stable supply chain.
Counterpoint Research: 3nm and 2nm will account for one-third of smartphone SoC shipments in 2026.
It is reported that Samsung reduction in production capacity of ultra-thin mobile phones may affect Taiwanese industrial chain including TSMC and Largan.
TDK acquires QEI’s RF power business to expand semiconductor equipment offering.
Continental has established a semiconductor division and teamed up with GlobalFoundries to design and manufacture automotive chips.
Samsung Exynos 2500 chip is officially released: tThe first to adopt 3nm GAA process and FOWLP packaging.
Siemens launches new EDA AI toolset for semiconductor and PCB design.
Intel releases edge AI controller and edge computer to create a new vision for AI.
