SEMICON Taiwan 2025 will focus on advanced packaging technologies including 3DIC, fan-out panel packaging (FOPLP), chiplets, and co-package optics (CPO).
Samsung plans to launch the third-generation 2nm process within two years and shift its strategy to stabilizing yield.
CoreWeave has obtained Nvidia new high-end AI chip GB300 NVL72 from the market for the first time, and the supplier is Dell.
US, Australia, India and Japan established “The Quad” to solve the rare earth supply problem.
Rumor has it that Apple has paused development of a foldable iPad.
Omdia: China TV market shipments will reach 38.3 million units in 2025, a year-on-year increase of 3.2%.
Infineon: The first 12-inch gallium nitride samples will be provided to customers in Q4 2025.
The opening of Samsung Tyler wafer factory has been postponed to 2026 due to lack of customers.
IBM strengthens alliance with Rapidus to target sub-1nm chip technologies.
