Intel CFO David Zinsner: 30% of Intel chips are manufactured by TSMC, future foundry may be split into a subsidiary.
Apple iPhone 17 memory suppliers: DRAM~Samsung 37%, SK Hynix 33%, Micron 30%; NAND~Kioxia 35%, SK Hynix 30%, SanDisk.
OpenAI cash burn has increased significantly and will exceed $17 billion in 2026.
NXP to relocate Hamburg HQ to boost automotive and industrial chip R&D.
BOE supplies the iPhone 17 Pro series.
ROHM launches ultra-low power CMOS op amp for compact sensor applications.
The registered capital of Yangtze Memory Technologies’ Phase III project is $2.91 billion, and construction may start soon.
US is rumored to be issuing annual licenses to Samsung and SK Hynix wafer fabs in China.
SEMICON Taiwan 2025 will be held from September 10th to 12th, focusing on the mass production progress of AI and CoWoS advanced packaging and testing.
