TSMC C.C. Wei: Sufficient power supply is needed for unrestricted capacity expansion.
DRAM prices continue to rise.
Price of some memory modules has increased by more than 300%, and price of mainstream DDR4 memory has increased by 10%.
INTEL 18A process debuts at CES: The third-generation Core Ultra processor redefines the AI PC.
Samsung announced its 2025 performance bonus ratio, increasing the bonus ratio for its semiconductor division to 47% of annual salary.
Telink ML9118A Wi-Fi module, with Wi-Fi 6 as its core advantage, opens up new possibilities for IoT connectivity.
Microchip launches military-grade plastic TVS devices for aerospace use.
Despite the rapid development of the new energy vehicle market, the traditional automobile engine market has maintained a stable growth trend.
TSMC: Accelerating the transfer of advanced chip technology to the US will narrow the gap to one year.
