TSMC aims to achieve a CoWoS capacity of 115,000 wafers, while Taiwan four major semiconductor packaging and testing companies (ASE, Powertech, SPIL, KYEC) are also making significant investments.
Amazon and STMicroelectronics have reached an agreement on building a data center.
Hanmi Semiconductor: Plans to launch TC bonding machines for producing HBM5 and HBM6 chips in H2 2026.
NanoIC focuses on chip design and manufacturing using processes below 2nm and its pilot production line has been officially launched, with the EU allocating €700 million for it.
Nittobo plans to raise the price of T-type glass fiber in 2026; however, increased production will not be realized until the end of 2026.
Trade agreement between US and India exempted Harley-Davidson motorcycles from tariffs, but Tesla was excluded.
Broadcom is facing increasing scrutiny from EU for restricting VMware licensing.
I Squared is considering selling its data center company BDx for $2 billion.
TDK rolls out stackable µPOL modules targeting AI server and ASIC power delivery.
Omron issues price hike notice as automation and core components face cost pressure.
