Lisa Su: AMD order growth exceeded expectations; institutional investors are optimistic about TSMC advanced process orders.
Tesla plans to discuss with Samsung the possibility of significantly increasing the production capacity of its AI6 chip. TheElec
SK Hynix advances new HBM packaging technology, potentially reducing DRAM layer spacing.
Asian semiconductor giants are expected to spend $136 billion in 2026, a 25% increase year-on-year.
Sam Altman warned his staff that OpenAI could not influence the US military decision-making; Anthropic was a cautionary tale.
Apple launched a new MacBook Air powered by the M5 chip.
Pasqal, French quantum computing company, plans to IPO through a merger with SPAC, with a valuation of $2 billion.
Kim Young-bae: The war with Iran threatens the supply of key raw materials and could drive up the price of South Korean memory chips.
INTEL expects to acquire EMIB packaging customers as early as H2 2026, thereby generating billions of dollars in revenue.
