TSMC expands its advanced packaging technologies in Taiwan, China, and the US, with CoWoS and CoPoS technologies adopted across various locations.
Amazon: Invests more than $200 billion by 2026 to accelerate AI and infrastructure development.
Eight Japanese companies, including SoftBank, have joined forces to form an AI company to create the most powerful AI model in Japan.
Huawei’s R&D investment reached $28.14 billion in 2025, surpassing Samsung.
INTEL, Rapidus, and TeraFab are all actively seeking partnerships with TSMC’s Taiwanese suppliers. DigiTimes
Kioxia is in talks with major cloud service providers about long-term supply agreements, categories extending to the NAND flash memory.
India has launched incentive programs to attract investment in electronic components, but R&D and talent shortages remain.
Chery plans to expand its production in Europe, possibly through collaboration with other automakers.
The average global DRAM price increase is expected to slow to 30%-50% in Q2 2026. Sigmaintell
The US semiconductor equipment market is projected to reach $10.87 billion by 2025 and grow by 81% by 2026. IEK Consulting
