Goldman Sachs: The memory supercycle is expected to continue until 2027.
Samsung has begun providing customers with samples of GDDR7 memory with speeds of 36 Gbps and a single-chip capacity of 24Gb (i.e., 3GB).
Musk stated that Tesla has completed the tape-out of the AI5 chip, which will be one of the highest-volume AI chips ever produced. AI6 and Dojo3 are currently under development.
Anthropic has secured a new round of funding, valuing at $800 billion.
It is projected that by 2026, Apple will hold a 19.3% share of the foldable phone market. TrendForce
Taiyo Yuden to raise prices across passive components from May 2026.
Semtech to raise IC prices, offers 30-day window before changes.
India pushes local electronics components manufacturing with 75 ECMS projects approved.
High-end CCL suppliers such as EMC, Taiwan Union, and ITEQ have collectively raised prices by as much as 40%.
Citigroup: Market demand for ASML semiconductor manufacturing equipment remains strong.
