SK Hynix is testing combining HBM and system semiconductors with an EMIB embedded substrate provided by INTEL.
Apple has reached an agreement with INTEL, under which INTEL will manufacture chips for Apple devices.
The packaging and testing industry is experiencing a capacity expansion boom, but the delivery time for some equipment is more than a year.
Microsoft’s data center project in Africa has stalled due to payment issues.
ByteDance reportedly plans to increase its spending on AI infrastructure by 25%.
TCL CSOT’s t8 project was completed ahead of schedule, accelerating the mass production of printed OLEDs.
Apollo and Blackstone Group are considering raising $35 billion for Broadcom.
Semiconductor materials market is projected to exceed $84 billion by 2028. TECHCET
NVIDIA is fully developing its AI ecosystem, with equity investments exceeding $40 billion in 2026.
