Samsung reduced wafer production and focused production on HBM chips before the strike.
SK Group will invest $778.46 million in glass substrates for panel-level packaging, a new mainstream in the development of advanced AI packaging.
TSMC has proposed the concept of a “three-layer AI cake,” emphasizing that its future progress will focus on integrating three aspects: Compute, 3D Integration and Photonics.
Power management IC prices are rising, with companies like Anpec, Silergy, and Richtek expected to benefit in H2 2026.
China has made a breakthrough in photonic chip technology, developing the world’s first 170GHz ultra-wideband device.
Anthropic’s valuation soared to $900 billion, surpassing OpenAI to become the world’s most valuable AI unicorn company.
TCL CSOT’s factory in Quang Ninh, Vietnam, has officially installed ESL equipment.
ARM is facing an antitrust investigation by the US Federal Trade Commission for allegedly abusing its CPU architecture to hinder its own chip development.
Mobile DRAM contract prices surged by over 70% in Q2 2026, putting pressure on smartphone costs.
