NVIDIA becomes the “core” of autonomous driving, while traditional automakers are facing a crisis of “pyramid inversion”.
Samsung completes prototype development of 900-layer ultra-high stacked 3D NAND flash memory. ETNews
Huawei showcased a range of high-capacity SSDs based on its self-developed chip packaging (DoB) technology at the ID Forum 2026.
AMD CEO Lisa Su stated that the CAGR of CPUs is expected to reach 35% over the next 5 years, and the revenue from China accounts for 20%.
Jensen Huang has arrived in Taiwan and will meet with Morris Chang and C.C. Wei.
The net profits of seven Japanese automakers are expected to be halved in fiscal year 2026.
Kioxia plans to mass-produce its 10th-generation BiCS 3D NAND flash memory in 2027.
Wiwynn addresses rising AI hardware prices and shortages: storage devices are the most scarce, followed by MLCCs, PCBs, and power supplies.
Micron starts US production of 1α DRAM to expand DDR4 supply, quadrupling its output.
