Initial test results for the NVIDIA Vera CPU show that it outperforms both AMD and INTEL.
Samsung was the first to deliver samples of the 12-layer HBM4E, offering an over-20 % performance improvement.
INTEL is expanding its EMIB packaging capacity and pushing forward with large-scale material, component and equipment procurement orders.
BYD releases 4nm intelligent driving chip “Xuanji A3”.
Anthropic raised $65 billion, doubling its valuation to $965 billion, surpassing OpenAI.
Samsung union employees have approved a pay agreement that promises bonuses of more than $400,000.
South Korea has launched a $6.6 billion investment plan to develop its domestic AI industry, aiming to be one of the top three globally.
ASE has launched the industry’s first 310mm panel-level packaging automated production line, which will be put into operation in H1 2027.
NVIDIA: New Taiwan headquarters to open in 2030, capable of accommodating 4,000 employees.
MediaTek has used TSMC’s A14 process to test and produce multiple chips.
