TSMC has unveiled its AP7 packaging and testing facility in Chiayi for the first time, aiming to expand capacity to meet Apple orders and AI needs.
INTEL: Two potential customers plan to use INTEL 14A test chip.
Samsung HBM4 chip will begin mass production in March to supply AI chips for NVIDIA.
Jensen Huang visited Taiwan again, hosting a banquet to solidify the alliance and discuss the establishment of a new headquarters.
Singapore invests nearly $800 million in AI research.
Lenovo: Seeking collaborations with multiple global AI modeling companies.
Shipments of server AI ASICs will triple in 2027 compared to 2024, and will surpass GPUs in 2028. Counterpoint Research
Pegatron first US factory was completed at the end of March, 2026 and will produce AI servers.
There is a significant premium between DRAM spot prices and contract prices; contract prices may experience a catch-up surge. Goldman Sachs
