Samsung plans to launch LPDDR5X-PIM samples in H2 2026. ZDNet
Micron CFO Mark Murphy: HBM4 has mass-produced and shipments have already begun. TheElec
SK Hynix launched a hybrid HBF and HBM architecture, offering up to 2.69 times the performance improvement.
Tower Semiconductor, NVIDIA silicon photonics supplier, is actively expanding production capacity and 70% of its future capacity may have already been booked.
Infineon rolls out isolated gate drivers to support next wave of SiC power systems.
ST launches Stellar P3E automotive MCU with on-chip AI acceleration for SDV platforms.
Zhipu GLM-5 is highly compatible with seven mainstream Chinese domestic chips, including Huawei Ascend, Moore’s Threads, and Cambricon.
China Electronics Technology Group Corporation (CETC) has successfully completed the tape-out of a high-end computing chip.
Wingtech: We are extremely disappointed and strongly dissatisfied with the latest ruling by the Dutch company court in the Nexperia case.
Samsung: It is developing zHBM, the core of which is to stack HBMs into a 3D structure.
