NVIDIA reportedly raises prices across its GPU bundles. BenchLife
AMD Lisa Su: Helios AI server is now in full production and is expected to ship by the end of Q3 2026.
SK Hynix Cheongju P&T7 clean room will be put into use three months in advance.
Samsung launched its HBM expansion project in Onyang, South Korea in October 2026, with plans to produce in 2029.
Samsung Electro-Mechanics has signed a supply agreement for MLCCs worth approximately $205.21 million for use in AI servers.
AMD unveils 2nm AI chip, MI455X and EPYC Venice showcased.
A high-numerical-aperture EUV lithography machine has arrived at the Albany Nanotechnology Center in New York.
IBM acquired HRL Labs, shifting towards a dual-track quantum computing strategy.
INTEL’s Q2 2026 revenue grew at its fastest rate in nearly 15 years, with demand for AI driving a 59% increase in its data center business.
NVIDIA and Amkor reach $1.5 billion chip packaging agreement.
