TSMC continues to face supply shortages in advanced 3nm and 2nm processes and advanced packaging capacity.
Apple accepted Samsung’s memory price quotes for Q1 2027.
Samsung and SK Hynix plan to advance sub-10nm DRAM technology around 2028.
Samsung invests $231 million in Euclyd, targeting the emerging market for NVIDIA GPU alternatives.
Meta plans to deploy its new in-house ARKE chip in H1 2027.
ASML plans to produce more than 110 EUV lithography machines by 2028. JPMorgan
Samsung Electro-Mechanics partners with Qualcomm to develop 2.1D organic bridge packaging.
TDK expands production of electronic components for AI servers.
Murata: MLCCs are set to enter a “super-cycle,” a trend expected to last at least until 2028.
Samsung may adopt a “dual-track” strategy for HBM production. ZDNET Korea
