TSMC collaborates with Kinsus to develop advanced packaging similar to EMIB.
EU launched a tender for an AI super factory and signed letters of intent with companies such as NVIDIA to supply hardware.
Kioxia began shipping samples of its ninth-generation NAND flash memory, improving performance by over 30%.
It’s reported that Sony added $62.5 million to the budget for its joint venture with TSMC.
Micron released a 14400MT/s DDR5 MRDIMM memory module on its official website.
US Department of Commerce plans to provide $874 million in support to seven semiconductor companies to develop AI chips and advanced computing technologies.
Several US lawmakers block Apple from buying Chinese memory chips.
Kioxia expects 50% of its production capacity to be under long-term contracts by 2028 and strong demand for NAND flash memory in H2 2026.
TSMC’s new 1.4nm wafer fab is ahead of schedule, with the first building scheduled for completion in April 2027.
