INTEL accelerates the construction of its Ohio wafer fab; the yield rate of its EMIB-T advanced packaging is approaching 90%.
MediaTek: Its AI ASIC projects will use TSMC’s CoWoS packaging and INTEL’s EMIB-T advanced packaging.
Google has announced its TPU v9 plan, to procure up to 15 million units by 2028.
Samsung’s foundry business is expected to reach 100% capacity utilization by the end of 2026.
Apple is evaluating Chinese storage suppliers in hopes of alleviating supply and cost pressures.
Renesas plans to close its Takasaki plant within 2-3 years due to pressure on its 6-inch production line.
LG Innotek invests $1 billion to build a semiconductor substrate factory in Haiphong, Vietnam.
Micron’s Taiwan union is dissatisfied with the 200% bonus cap and plans to follow Samsung’s example and launch a strike.
Samsung’s second Taylor factory in the US will break ground at the end of 2026 and begin mass production in 2030.
