INTEL’s EMIB-T costs 50% less than TSMC’s CoWoS, and Broadcom and Meta are also evaluating adoption.
HP, ASUS, and Acer began using Changxin Memory chips.
SK Hynix and SanDisk released the first HBF standard specification and showcased storage solutions for AI at the FMS in 2026.
Industry insiders revealed that the three major memory chip manufacturers have completed negotiations on the allocation of their production capacity for 2027, and the production capacity of DRAM and HBM has been completely sold out.
TSMC: Kumamoto plant has resumed normal operations.
LG Innotek is considering using glass substrates to package image sensors for robots.
NTT Data will invest $9 billion to build a data center in Japan, boosting AI computing power to one gigawatt.
DeepSeek V4-Flash’s model running cost is less than one percent of that of Anthropic Claude Fable 5. Artificial Analysis
