Samsung accelerates the R&D of silicon photonics technology and plans to complete wafer testing by the end of 2026.
Qualcomm: Amazon may purchase AI data center chips and related products worth up to $60 billion in the future.
NVIDIA’s Rubin Ultra chip is reportedly to switch to 8-layer HBM to control memory costs.
OpenAI plans to begin deploying “Jalapeño,” an AI chip developed in collaboration with Broadcom, by the end of 2026.
Kioxia has denied rumors of closer ties with SK Hynix and pledged to curb the rise in chip prices.
Samsung has opened an advanced chip packaging R&D center in Japan.
Samsung Electro-Mechanics and LG Innotek are testing products, aiming to enter INTEL’s EMIB-T supply chain.
ASML has begun construction on a second large-scale production campus; the first phase is expected to be completed in 2029.
Google plans to build a data center in Finland with an investment of $15.1 billion.
