TSMC’s 2nm monthly capacity will increase from 90,000 wafers at 2026-end to 110,000 by mid-2027, while 3nm capacity rises from over 180,000 to 210,000.
Samsung resumed foundry talks with Qualcomm to negotiate product specifications, pricing, and process optimization as 2nm process yield has risen to 50%–60%.
Samsung and SK Hynix refuse to prepay a total of $18.57 billion in electricity costs over five years.
UAE adjusts AI data center plans following Iranian attack.
Fujitsu will export AI CPUs for supercomputers in 2027.
TuringQ has released TuringQ Gen3—a large-scale, chip-level scalable photonic quantum computer.
Micron and SanDisk head to South Korea to vie for key semiconductor talent.
Microsoft reportedly plans to more than double its global data center capacity by 2032.
