TSMC is reportedly going to begin trial production of its A14 process in Q1 2027.
INTEL is reportedly collaborating with AUO to develop integrated solutions for CPO and high-density computing chips.
The market for custom AI ASICs will reach approximately $60 billion to $70 billion by 2026. JPMorgan
AI drives demand for chips produced using mature process technologies; UMC and PSMC are evaluating price hikes, with increases expected to be more significant by 2027.
Tesla is reportedly heading to Ningbo to prepare for mass production of Optimus.
BOE, TCL CSOT, and HKC have announced price hikes for display panels.
Market rumors indicate that AMD plans to raise chip prices by approximately 10% in Q4 2026, primarily driven by price hikes from TSMC.
A groundbreaking ceremony was held in Kaohsiung, Taiwan, for a brand-new, state-of-the-art advanced packaging industrial park.
