Nvidia market value exceeded US$4 trillion for the first time driven by the AI boom. Alibaba DAMO Academy once again appeared at the UN AI for Good Global Summit, and its multi-cancer early screening AI has served 20 million people in…
TSMC plans to start construction of two advanced packaging plants in US in 2028, and expand SoIC and CoPoS packaging to meet local production of AI and HPC chips. Nvidia plans to launch customized AI chips for China in September, and…
Intel Israel is laying off hundreds of employees and considering closing Fab 28. Apple acquired two startups involved in XR and AI technologies, TrueMeeting and WhyLabs. PwC: By 2035, one-third of global chip production may face copper supply disruptions. TrendForce…
US One Big Beautiful Bill Act may help TSMC speed up the construction of its factory in Arizona. UMC won a large order from Qualcomm for advanced packaging and cooperated with Intel on 6nm wafer foundry. Japan chip equipment sales forecast…
Nvidia B200 chips remain in short supply despite continued production increases. Wedbush TSMC two highlights in 2026: Price increases for advanced processes and CoWoS, and increased demand of 2nm in smartphones. Goldman Sachs Samsung Q2 2025 profit plummeted 55.9% to US$3.3…
Qualcomm second-generation Snapdragon 8 Elite Gen 2 flagship mobile processor has abandoned Samsung 2nm foundry and instead exclusively adopted TSMC N3P process. wccftech reported TSMC: US investment would not affect its wafer fab plans in Germany and Japan. Alibaba, Huawei,…
Samsung is rumored to postpone mass production of 2nm chips to 2029. TSMC delayed construction of its factory in Japan and prioritized investment in US to circumvent Trump tariffs. Samsung plans to continue to improve the performance of 7nm and…
Compete for 1.4nm process: TSMC is firmly in the lead, Intel adjusts its strategy, and Samsung postpones mass production. OpenAI, Amazon, and Meta have collectively invested hundreds of billions of dollars in creating AI systems. Samsung has confirmed that LPDDR6…
SEMICON Taiwan 2025 will focus on advanced packaging technologies including 3DIC, fan-out panel packaging (FOPLP), chiplets, and co-package optics (CPO). Samsung plans to launch the third-generation 2nm process within two years and shift its strategy to stabilizing yield. CoreWeave has…
Samsung Foundry is seeking to compete for Nvidia’s 2nm GPU orders. TSMC confirmed to gradually withdraw from the gallium nitride business in the next two years. Lip-Bu Tan adopted an aggressive strategy, and there were reports that Intel canceled its…
