AMD collaborates with AI startups to accelerate innovation in chip and software design. Samsung and Micron have successively stopped production, and the spot price of DDR4 has soared by 8% in a single day. Apple modular AI glasses are gaining…
TSMC 2nm yield rate exceeds 60%, followed by Samsung at 40%, resulting in fierce competition for orders in H2 2025. Micron becomes first supplier of Nvidia SOCAMM memory chips. AMD Lisa Su: The potential market size of data center AI…
Jensen Huang announced the expansion of AI layout: Helping Europe’s computing power increase 10 times in 2 years. Samsung LSI and foundry divisions are said to be working to increase the yield of the 2nm Exynos 2600 to 50%. Micron/Amkor/SK…
AMD MI350 series: Inference performance increased by 35 times, surpassing Nvidia B200. MI400 computing power will double in 2025. Nvidia first Arm PC chip exposed: performance exceeds Qualcomm Snapdragon X Elite. Crusoe plans to spend $400 million to purchase AMD…
TSMC Kumamoto Fab 2 will start construction in H2 2025 and will introduce a 6nm process. AMD confirms that the MI350X AI chip will use Samsung/Micron HBM3E. Micron HBM4 has been shipped to major customers, promoting the implementation of the…
NVIDIA and G42 partner to build Blackwell chip data center to promote the development of AI infrastructure in the UAE. NVIDIA and Perplexity team up to help AI companies in Europe and the Middle East improve local language model technology.…
Nvidia Jensen Huang: Will build 20 AI factories in Europe, and quantum computing has reached a turning point. Nvidia’s suppliers are facing shortages of key minerals and have only enough inventory to last a few weeks. Samsung Exynos 2600 prototype chip…
Nvidia commissioned Samsung, SK Hynix and Micron to develop SoCEM modules, with Micron being the first to receive approval for mass production. China rare earth restrictions deal a blow to AI data center providers. NXP plans to close four 8-inch…
TSMC CoPoS packaging technology focuses on AI and high-performance computing, and will establish the first experimental line in 2025. Nvidia and HPE team up to build a new supercomputer using next-generation chips. IBM plans to launch a practical quantum computer…
White House official: China may be only 3-6 months behind US in the field of AI models. TSMC US wafer factory construction is accelerating, and the A16/N2 chip is expected to go into production 6 months ahead of schedule. TSMC…
