Macquarie: TSMC production costs in the United States may be 30% higher than in Taiwan.
ROHM and TSMC form strategic partnership in automotive GaN power devices.
Synopsys plans to sell two assets as it seeks EU approval for its $35 billion acquisition of Ansys.
Apple is said to be working with Broadcom to develop AI chips, which may be mass-produced in 2026.
Details of Fujitsu new server chip Monaka have been revealed: 2nm process, 144 cores, based on Broadcom’s 3.5D XDSiP platform.
Diodes Inc. introduces automotive-compliant current shunt monitors for high-precision voltage sensing and rapid fault detection.
onsemi acquires Qorvo’s SiC business to strengthen EliteSiC portfolio.
Marvell announced the launch of its Custom High Bandwidth Memory (CHBM) solution for custom XPUs targeting AI applications.
OpenAI CFO: The next generation of cutting-edge AI models will cost billions of dollars.
