Nvidia plans to build a new R&D center in Shanghai.
AMD x86 server CPU market share grew to 39.4%.
US congressmen proposed the “Chip Security Act”, requiring AI chips to have built-in location tracking mechanisms within 180 days.
French company Iten is working with the A*STAR IME to integrate solid-state battery technology into wafer-level 3D packaging.
Broadcom launches third-generation co-packaged optical technology, supporting 200G/channel.
Vishay boosts thick film resistor line with automotive-grade model for higher pulse protection.
Qualcomm returns to the server CPU market and reaches cooperation with Saudi Arabia HUMAIN.
AI infrastructure company TensorWave completed a $100 million Series A financing round led by AMD.
Mizuho Securities: Huawei will ship 700,000 Ascend AI chips Ascend 910a/b/c by 2025.
