Intel releases three Xeon 6 series AI CPUs.
Crusoe Texas data centers received $11.6 billion in financing and use 50,000 Nvidia Blackwell chips per building.
Deca joins hands with IBM to build an advanced packaging production base in North America.
Samsung expands 1c DRAM production capacity, hoping to narrow the gap with competitors through HBM4.
Cadence launches industry-leading HBM4 12.8Gbps IP memory system solution to enable next-generation AI and HPC systems.
Foxconn Bengaluru plant will start shipping iPhones in June 2025.
TDK expands smallest 0201 high-frequency inductors for mobile applications.
JNTC built South Korean first semiconductor glass substrate factory, with a monthly output of 10,000 pieces.
South Korean government submitted a letter of opinion to US, calling for avoiding additional tariffs on chips.
