TSMC is reportedly in talks to acquire AUO’s two panel factories to expand advanced packaging capacity.
SK Hynix has confirmed that its V10 NAND flash memory uses a 375-layer stacked structure and incorporates wafer bonding technology.
Qumulus AI and Agentic Hedge Fund have reached a cooperation agreement on NVIDIA GPUs.
Apple is reportedly testing Changxin memory chips for use in devices sold in the Chinese market.
NVIDIA plans to invest $3 billion in Lancium to boost the development of power infrastructure.
Apple Mac supports document updates and confirms collaboration between “Apple Intelligence” and Qianwen Model.
Samsung’s factory in Texas is about to begin production; recruitment for its first batch of interns has officially begun.
Japan’s GMO Internet will spend $63.65 million to purchase NVIDIA B300 GPU servers.
Sony and TSMC plan to invest $6.3 billion to mass-produce next-generation image sensors in Kumamoto, Japan.
Samsung HBM4 yield rate has recently reached 80%. South Korea media
