TSMC Arizona factory successfully shipped the first batch of Nvidia, AMD and Apple chip wafers.
Samsung postponed the mass production of 430-layer NAND Flash due to manufacturing difficulties.
Amazon and SK Group jointly built South Korea’s largest AI data center, which will deploy 60,000 AI GPUs.
Japan has launched a $693 million plan to attract overseas AI and semiconductor research talent.
SoftBank seeks to raise $4.9 billion from sale of T-Mobile stake.
Volvo and Daimler seek technology joint venture to cut costs.
Analog Devices launches ADVentures fund to back early-stage robotics, energy and health startups.
Qualcomm is rumored to launch the Snapdragon 8s Gen 5 by the end of 2025.
Intel Nova Lake specifications exposed: up to 53-core CPU, 150W TDP.
