The U.S. government is considering aiding Intel if necessary or pushing its chip design business to merge with AMD, after the billions of dollars in “CHIP Act” subsidies Intel is already scheduled to receive.
The Biden administration of the United States announced a fine of $500,000 on U.S. chipmaker GlobalFoundries for illegally shipping more than $17 million worth of wafers to SJ Semiconductor, which is on the entity list managed by the U.S. Bureau of Industry and Security (BIS). Reuters reported.
In order to cut costs, Intel’s plan to lay off 15,000 employees worldwide is accelerating. Intel’s Israel R&D center has laid off hundreds of employees, and dozens of Intel employees also left to join Nvidia at the beginning of 2024. Globes reported.
Samsung set to halt 50% of wafer foundry lines in Pyeongtaek by year-end to cut costs.
Infineon has successfully achieved large-scale production of the world’s thinnest silicon power wafers, measuring just 20 micrometers in thickness and 300 millimeters in diameter.
Vishay releases high-energy inrush current limiting PTC thermistors to enhance performance in charge and discharge circuits.
KYOCERA AVX announces Industry’s First Dual-Entry Card-Edge Connectors.
Apple M4 Ultra will be launched next year and may have a 32-core CPU and an 80-core GPU.
By 2030, the annual power consumption of EUV lithography machines alone will exceed 54,000 gigawatts.
